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展商 展品

Panel Bonding Equipment

展商：Tokyo Denki Kagaku.

原产国/地区：日本

Flexible Design Supports various bonding requirements - Covers all major bonding processes - Maximum Panel Size: 650mm - Wide Range of Chip Sizes

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Flexible Design 

Supports various bonding requirements

- Covers all major bonding processes

- Maximum Panel Size: 650mm

- Wide Range of Chip Sizes