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Switzerland’s Bystronic signs up to show laser cutting systems at CIIE Release date: 2018-06-07
Bystronic Group has signed a contract with the China International Import Expo to exhibit some of its high-end intelligent equipment at the first ever CIIE.
The group is chiefly a solutions provider for plate processing and facilitating the automation of material and data flow during the cutting and bending process. Its products include laser cutting systems, press brakes and related automation and software solutions. Bystronic will bring its 15
Bystronic Group mainly provides senior solutions for plate processing, facilitating the automation of the whole material and data flow during the cutting and bending process. The company’s products include laser cutting systems, press brakes and corresponding automation and software solutions. Bystronic Group will bring its 15 KW laser cutting machines, whose techniques are of the top level in the world, to the China International Import Expo.