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Forum Guest | Turing Award winner Jack Dongarra will participate in 6th Hongqiao International Economic Forum Release date: 2023-08-31    Source:China International Import Expo Bureau

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Jack Dongarra, a member of the American Academy of Engineering and currently a professor at the Faculty of Electrical Engineering and Computer Science at the University of Tennessee. [Photo/CIIE Bureau]

Turing Award winner Jack Dongarra, has confirmed participation in the 6th Hongqiao International Economic Forum. He will attend the parallel session themed “Intelligent Technology and Future Industry Development” and deliver a keynote speech.

Jack Dongarra, a member of the American Academy of Engineering and currently a professor at the Faculty of Electrical Engineering and Computer Science at the University of Tennessee, is a pioneer in the fields of supercomputer benchmarking, numerical analysis, linear algebra solvers and high-performance computing. In March 2022, Jack Dongarra was awarded the Turing Award 2021 for his significant contributions to the development of high performance computing.

Further reading:

Turing Award was established by the American Computer Association (ACM) in 1966 to award those who have made important contributions to the computer industry. It is named after Alan Turing, a pioneer in computer science. The Turing Award is the highest award in the computer industry and is known as the "Nobel Prize in the computer industry".

The Hongqiao International Economic Forum (Hongqiao Forum) is an important part of the China International Import Expo. Under the theme of "Joining Hands in Development, Opening Up for the Future", the 6th Hongqiao Forum will feature the main forum (opening ceremony of the 6th CIIE and the Hongqiao Forum), the "Invest in China Year" Summit, the Press Conference and International Symposium on World Openness Report 2023 (including the release of the World Openness Index), as well as 22 parallel sessions divided into four sections: "Opening-up for Development", "Opening-up for Cooperation", "Opening-up for Innovation" and "Opening-up for Sharing". (For more information, please click the link.)